This will typically result in an increased failure rate. The copper may
increase in concentration within the OSP due to migration that can cause
some degradation due to atmospheric exposure. The more likely failure mode
would be the thermal decomposition of the organic components themselves
rendering the deposit ineffective against oxide intrusion. In addition, the
coating itself may prove more difficult to remove resulting in a barrier to
solder bonding.

It will depend on the extent (time/temp) the board will need to be exposed
to effect drying. Avoid it if you can, but in the event it is unavoidable,
minimize exposure and test for efficacy.

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