I am having a problem with inspection of the above mentioned subject, My branch has contracted to build the end item product for NAVSEA, The supplier of the circuit cards sub-contracted the building of same. I have been doing incoming inspection of the circuit cards and found numerous defects in the area of side overhang exceeding 25% of the component pad. This area has irritated the supplier to say the least, and has responded by saying that the only inspection criteria that I can now use is by inspecting the leads from the toe end of the leads,straight on and not from a top view that is required because of the enourmous amount of surface mount components. The inspection criteria for these circuit cards is per IPC-610, class 3, High Performance Products. My question to you, "Is this the only way that I am allowed to inspect the leads or am I allowed to inspect them from all angles if necessary ?" and is this process documented in IPC-610 anywhere? Because I can't seem to find it anywhere between the covers of the manual. Lonnie Brinson Code 6072 Bldg 2930 854-2301 ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################