Hi everyone, We are an assembly company that uses pre-baking of the flex substrates (Kapton and polyimide) as part of our pre-production process. We're planning to eliminate this process as part of our cost reduction. What will be the effect with regards to its assembly and reliability. The flex is use for cameras, is there any effect on the type of product it is being used. Are there any technical bulletin or standards that will suffice our plan. Any inputs regarding this matter will be highly appreciated. Regards, Edwin Maximo Value Engineer Electronic Assemblies Inc. ################################################################ DesignerCouncil E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE DesignerCouncil <your full name> To unsubscribe: SIGNOFF DesignerCouncil ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################