Hi everyone,

We are an assembly company that uses pre-baking of the flex
substrates (Kapton and polyimide) as part of our pre-production
process. We're planning to eliminate this process as part of our cost
reduction. What will be the effect with regards to its
assembly and reliability. The flex is use for cameras, is there any
effect on the type of product it is being used. Are there any
technical bulletin or standards that will suffice our plan. Any
inputs regarding this matter will be highly appreciated.

Regards,
Edwin Maximo
Value Engineer
Electronic Assemblies Inc.

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