Hi Brian -

We've had good success preserving board condition and solderability by having
the suppliers pack the clean, dry boards in vapor barrier bags and heat
sealing the closures.  It is important to remove excess air at time of
closure.  A nitrogen purge can also be used, if desired.   Boards can be
packed individually or in multiples, as best fits your application.  We
generally have the supplier leave sufficient excess material that the bags can
be opened and resealed a couple of times.

I would recommend inclusion of a humidity indicator just to have confirmation
that the package has remained sealed.  Dessiccant is usually not necessary.
(A dessiccant bag can sit around acting like a sponge if the pack is
penetrated.)

Regards - Kelly

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