We have had continual problems with "metallized film chip capacitors" expanding after going through a wash cycle and then the board going through wave solder. I understand that these capacitors are not encased or completely sealed--as are ceramic chip caps--my question is sort of two-fold. 1. Does anyone have recommendations as to another material that may have similar properties as the metallized film (my engineers have mentioned the superior low microphonics of the metallized film)? and 2. Has anyone had similar experiences and developed a workaround or solution to this problem. One last note is that we are following the manufacturer's specs for reflowing these caps, but we get into trouble when the boards (which need to be washed due to a water-soluble flux) have to subsequently go through a wave cycle and the trapped moisture from our wash process expands, popping the little suckers. Any help is much appreciated. Chad Thibodeau Component Engineer [log in to unmask] 2114 W. 7th Street Tempe, AZ 85281 P-602 333-2138 F-602 921-9012 http://www.efdata.com ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################