Doug, The main publication that I have been using is the SMTA (Surface Mount Technology Association) TP - 101A, revision May 1994. I looked in seeing if they had a more current revision about a year ago, they said that was the latest. Thanks, Greg Kaskey > -----Original Message----- > From: Doug Shawver [SMTP:[log in to unmask]] > Sent: Tuesday, January 19, 1999 2:51 PM > To: [log in to unmask] > Subject: [DC] Rigid PWB, ICT probe pad air gap requirements > > The following questions relate to ICT (In Circuit Test) of assembled rigid > PWB's > using conventional .050", .075" or .100" probes used in test fixtures. > (Flying probes > are not of interest due to volume of units built). > > 1) Is there an industry specification that address the air gap required > from the edge > of ICT test pads to SMT component body's and/or component pads? > > My dilemma: IPC-SM-782 section 5.7.2 states: "Test lands should be .025 > minimum > from mounting land areas." This does not specify the spacing from the > component > body nor does it seem sufficient to the land areas. Our vendors use > IPC-A-610 to > inspect assembled boards. If the assembly is class III and a 1206 resistor > is on the > board IPC-SM-782 section 5.7.2 would seem to allow a test pad to be .010" > under > the part. Obviously, this is not what we want. > > 2) Is there another industry specification such as IPC, Bellcore, etc. > that > addresses this > issue? If so, please indicate the specification #. If you have an internal > specification that > addresses this issue I would be grateful if you could share what your > parameters are. > > 3) Is there a specification that defines the probe pin accuracy or > location > tolerance of > .050", .075" and .100" probes used in a "standard" ICT test fixture? > > I've been reading IPC's tech-net and design-net mail for years and there > is > a wealth of > knowledge in this mailing list. > > Thanks for any help you can provide. > Doug > > ################################################################ > DesignerCouncil E-Mail Forum provided as a free service by IPC using > LISTSERV 1.8c > ################################################################ > To subscribe/unsubscribe, send a message to [log in to unmask] with > following text in the body: > To subscribe: SUBSCRIBE DesignerCouncil <your full name> > To unsubscribe: SIGNOFF DesignerCouncil > ################################################################ > Please visit IPC's web site (http://www.ipc.org) "On-Line Services" > section for additional information. > For technical support contact Hugo Scaramuzza at [log in to unmask] or > 847-509-9700 ext.312 > ################################################################ ################################################################ DesignerCouncil E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE DesignerCouncil <your full name> To unsubscribe: SIGNOFF DesignerCouncil ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################