IPC-VT-MHD Microvias and High Density Interconnects To maximize the benefit of miniature IC packaging, the user must consider efficient and cost effective use of the circuit board fabrication technology available today, as well as looking ahead to emerging technologies. Multilayer circuits using via-in-land or "microvia" methodology provide the designer direct access to higher circuit density on the subsurface layers of the circuit structure. Three alternative microvia interconnect methods are currently in use: laser, photo-defined and plasma-displacement. Detailed information and design guidelines that are specific to each of the microvia technologies noted above are discussed. In addition, examples of fine-pitch QFP, BGA, and CSP products are examined, circuit routing criteria defined and other issues related to adapting miniature IC device packaging and high density circuits are reviewed. Also covers drivers for product miniaturization, base material selection for HDI, IC component packaging, planning for high density circuits, panelization for assembly efficiency, and sources for HDI and cost considerations. Presented by Vern Solberg or Tessera Inc. at IPC Assembly Expo, October 1998. Includes Workshop Handbook containing 118 images presented during the workshop. Edited to two videotapes. Time: 1 hour 37 minutes. IPC Members: $350 Nonmembers: $500