J-STD-033 Standard for Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices This document provides SMD manufacturers and users with standardized methods for handling, packing, shipping, and use of moisture/reflow sensitive SMDs. These methods are provided to avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation. By using these procedures, safe and damage-free reflow can be achieved with the dry packing process, providing a minimum shelf life capability in sealed dry-bags of 12 months from the seal date. 20 pages. Released April 1999. IPC Members: $20 Nonmembers: $40 Single-User: $30 Single-User: $60 ################################################################ IPC_New_Releases E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE IPC_New_Releases <your full name> To unsubscribe: SIGNOFF IPC_New_Releases ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################