J-STD-033
Standard for Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface
Mount Devices

This document provides SMD manufacturers and users with standardized methods for
handling, packing, shipping, and use of moisture/reflow sensitive SMDs.  These
methods are provided to avoid damage from moisture absorption and exposure to solder
reflow temperatures that can result in yield and reliability degradation.  By using
these procedures, safe and damage-free reflow can be achieved with the dry packing
process, providing a minimum shelf life capability in sealed dry-bags of 12 months
from the seal date. 20 pages.  Released April 1999.

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