I have received an RFQ for boards that need to have vias plugged with liquid mask AFTER hot air leveling.  I can't think of a good reason why someone would want to plug vias at that stage (as opposed to the more conventional plug before LPI coating) and whether this process would be effective during successive reflows of the board during assembly, but maybe I'm missing something.

Any help would be greatly appreciated.

Kiko Vigano

---------------------------------------------------------
Adeodato Vigano
Compunetics, Inc. - PCB Division
phone (412) 858-6115
email [log in to unmask]
---------------------------------------------------------