Call for Papers IPC/CCA NATIONAL CONFERENCE ON BAREBOARD AND ADVANCED SUBSTRATE ELECTRICAL TESTING: HDI'S HOLY GRAIL May 20-21, 1999 San Jose Hyatt, San Jose, California The lines are skinny, the pitches are fine, the lands are tiny, and the vias are microscopic. The printed wiring board is shrinking impressively, but does it work? Because it defies conventional bed of nails methods, the high tech PWB is turning substrate electrical test into a kind of "holy grail" in the movement toward system miniaturization. What will work with blind and buried vias? When is testing necessary? What is new on the fixtureless and non-contact fronts? IPC and CCA are sponsoring a national conference to explore these and many other questions. Technical papers that identify critical, unresolved issues are sought from users and suppliers of test equipment. Presentations at the conference should be no more than 45 minutes in length. Similar papers may be grouped or presented in a forum or panel discussion. Topics should address: · The HDI PWB as test driver · Handling fine pitch and high density · Embedded resistors and capacitors · Fixtureless testers · Fixture materials · Standardization progress · Roadmapping test technology · High Volume testing · Effective Designs for testability · Non-contact solutions · Test parameters * when not to test? · Test "traps" in PWB manufacturing? Papers/presentations must be non-commercial in nature, focusing on technology rather than a company's product. It is mandatory to provide a print-quality paper and/or hard copies of visuals for the conference proceedings in order to deliver a presentation. IPC must receive papers by April 17, 1999. All technical conference presenters will receive admission to the conference, including refreshments, lunches and the conference proceedings at no charge. To submit an abstract: Please send your presentation title and a 200-300 word description along with your full name, address, phone, fax, e-mail and your brief biography to John Riley by fax to: 847/509-9798 or by e-mail to: [log in to unmask] Abstracts are due by February 17, 1999. Conference Program Committee: Bryan Franklin, F.C.C., Co-Chair Fred Karkalik, KAR Technologies, Co-Chair Duane Delfosse, ECT Circuitest, Inc. Robert Hanson, Americom Services Dana Korf, HADCO Santa Clara Bob Neves, Microtek Laboratories Maryellen Hilderbrand Education Manager IPC 2215 Sanders Road Northbrook, IL 60062-6135 Phone: 847.790.5382 Fax: 847.509.9798 E-mail: [log in to unmask] URL: http://www.ipc.org ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################