We are actually in the situation that we want to start the solderball apply with an microBGA flextape package and we seen some problems with the ball surface (SnPbAg alloy) after reflow. It looks rough and matt visually. Does anyone know or has proposal what kind of flux is usally used for solderball apply to a gold plated copper via pad for sollball reflow ? Any information s welcome. Achim ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################