I am doing some research on HAND SOLDERING CRITERIA, for a project I am
currently undertaking.
I would like some fundamental information regarding the criteria for a
hand soldered joint between the  component lead and the contact pad on
the printed circuit board.
Criteria I am looking for is of the nature;
-    mechanical strength of soldering joint
-    electrical strength and properties of soldering joint
-    thickness of solder joint

If someone can help me with this information (or more) it would help me
in my current project.

thanks

M.C.M.

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