Hi everyone, we are looking at alternative low cost packaging for IC's.
Question is, how to deal with routed areas of FR4 that can produce unwanted
dust, particals, etc. Proposed solutions so far include plating edges,
and/or using a sealant. Anyone with any experience in this area?

Thanks  in advance.

Mike Joyner
Design Engineer
Photon Vision Systems
P.O Box 509
Cortland, NY 13045.
tel. 607.756.5200
fax 607.756.5319

www.photon-vision.com
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