On 21 Dec 98 at 7:29, Mike Bailey wrote: > We continue to see current designs incorporating via hole > configurations utilizing "wagon wheel" interconnects to plane > layers. I use direct connects whenever no thermal reasons need "wagon wheel" style. That means, vias (no THT holes) without thermals, and all thru-holes with leaded components which become hand- or wave-soldered, with thermals. I can set up this without problems in my CAD system which type of hole gets spokes or not by default. Regards Matthias ----------------------------------------------- Matthias Mansfeld Elektronik * Printed Circuit Board Design and Assembly Am Langhoelzl 11, D-85540 Haar, GERMANY Phone: +49-89-4620 0937, Fax: +49-89-4620 0938 E-Mail: [log in to unmask] Internet: http://www.mansfeld-elektronik.de ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################