I am seeking information on the direct versus electroless metalisation process used for the manufacture of via holes. I would be interested to hear from anyone having done research on the processes or has direct experience as a PCB end user. As end users of PCB's ourselves we are hearing conflicting views on the suitability of the direct plate process for high layer count (6 +) , high aspect ratio circuit boards. It is preferrably from end users of such PCB's that I would most like to hear from regard the particular direct plate system used in the manufacture of their boards, the complexity of the board (aspect ratios, layer count etc), the end environment their boards are used in and any reliability issues they may have experienced. Chris James Engineering Services Manager Dolby Labs Inc. [log in to unmask] ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################