I've created a spread sheet based on IPC-SM782A-Amend1. Recently I was asked
to increase Max/Min "L" Dim for Manuf
size of MLC Capacitors with soldercoat. This is to account for solder coat
dimension. This number would be .015 per end-termination. I believe I
usually see about 7-10 mils in most manufacturing data. As well, does this
soldercoat get reflowed (vapor) and become part of the fillet? If so, I
would be tempted to suggest to ignore this additional dimension.

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