Hi! I am using a solder fountain process to solder a PGA processor chip on a double sided board. This is a fairly new process to me and we are getting solder bridges on some of the pins on the PGA chip. The board is preheated before it hits the solder fountain. The top side temperature of the board is 150C (220F), the solder temperature is 260C (500F) and no-clean flux was used. I wonder if anyone out there has had success in using solder fountain to solder PGA. Thanks, Lik-Jen Wu Nortel Networks (Wireless) Manufacturing Engineer Tel: 403-781-4612 Fax: 403-232-4321 ESN: 760-4612 email: [log in to unmask] ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################