Hi! I am using a solder fountain process to solder a PGA processor chip on a
double sided board. This is a fairly new process to me and we are getting
solder bridges on some of the pins on the PGA chip. The board is preheated
before it hits the solder fountain. The top side temperature of the board is
150C (220F), the solder temperature is 260C (500F) and no-clean flux was
used.

I wonder if anyone out there has had success in using solder fountain to
solder PGA.

Thanks,
Lik-Jen Wu
Nortel Networks (Wireless)
Manufacturing Engineer
Tel: 403-781-4612 Fax: 403-232-4321
ESN: 760-4612 email: [log in to unmask]

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