Mike, I agree with you; we make all connections to internal layers (except for through-hole component holes) with direct connections. The only reason that I have found to keep the "wagon wheel" (thermal relief) connections is for identification during the PCB design process. We keep the thermal relief connections during the design process, then remove them just before the PCB is released to the manufacturer. These thermals allow us to see where connections are made to the internal planes when looking at individual layers. Hope this sheds some light. Benjamin G. Thomas OEM Controls Inc. Shelton CT -----Original Message----- From: Mike Bailey [mailto:[log in to unmask]] Sent: Monday, December 21, 1998 7:29 AM To: [log in to unmask] Subject: [TN] Via Configuration We continue to see current designs incorporating via hole configurations utilizing "wagon wheel" interconnects to plane layers. Didn't the purpose of this design become obsolete unless thru-hole leaded components and wave soldering are necessary? Why not simply go with direct connects? Can someone shed some light on this subject? ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################ ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################