In message <[log in to unmask]> [log in to unmask] writes: > Anyone have any experience with a SMD removal kit called Chip Quik? I used > it on a few of my test cards and was impressed. Are there any restrictions > on the use of this type of material? Any good or bad experiences with it? > Any info would be appreciated. Email [log in to unmask] if you'd prefer. Chip Quik is a low melting temperature solder alloy, containing bismuth, IIRC. It works by being melted into the existing solder joint, mixing with it and thereby lowering the liquidus temperature. It is then easy to keep all the solder joints of, say, a QFP molten at the same time with a simple hot air tool or iron, and lift off the device. The concern is that you will leave behind a thin intermetallic layer of bismuth containing alloy on the pcb pads. Bismuth is not very mobile, so when you make the new joint, the bismuth probably stays where it is i.e. in a thin layer next to the pad. Bismuth is also very brittle (take a piece of Chip Quik alloy, and bend it - it breaks easily, unlike 63/37). I wonder how reliable this joint will be in future, and whether is it more likely to crack at this interface? I dunno, no data, just a query. I would guess that it would be fine to use or your TV remote control repair, and a bit reckless on your jet fighter engine control system. I would be very interested to see any test data to prove or disprove these thoughts. Peter -- ::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::: Peter Swanson Oxfordshire, England INTERTRONICS [log in to unmask] http://www.cygnetuk.demon.co.uk Suppliers of materials and consumables to the electronics & related industries ::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::: ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################