Hi, We have several applications of attaching heatsinks to IC's at our plant and currently it seems that the easiest method is to use a double sided thermal tape. We are currently applying the tape manually and using hot air guns to heat up the surfaces and tape to decrease the pressure and time required for the adhesive to set. However, we are searching for a more reliable and consistent automated method for attaching the heatsink to the IC's without putting the solder joints in jeopardy. Does anyone know of any press manufacturers that may carry something for this type of application? We are talking about 30 psi at room temp for 5 sec or 10 psi at 50-65 deg C for 5 sec. Does anyone know of a better process besides thermal tape? Any feedback is appreciated. Thanks. Chi Wong Process Manufacturing Engineer [log in to unmask] ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################