Our CM (Contract Manufacturer) has requested larger pads then depicted in IPC-782 on the solder side (bottome side) passiive components. In talks with various consultants, there remarks were both the width and depth should be enlarged over 782 to avoid solder skips. The passive parts are perpendicular to the wave and there is room for the 10 % enlargement. What are your thoughts or experience. ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################