Francis, I have seen this resist lift problem myself. You need a robust film for gold plating at least 2mils thick, not the standard primary imaging film. You mentioned over exposing the film which is the last thing you want to do. We found this made matters worse. The release of hydrogen at the cathode affects the resist by polymerising it further. It becomes brittle, loses adhesion and lifts. We found the best result was to underexpose and plate straight away. Even exposure to daylight should be avoided after developing the film. If you are pattern plating with copper then you will need to change to panel plate and apply the resist for the gold pattern only. This does increase the etch factor but prevents track spreading because the copper plating cycle weakens the resist. Hope this helps Paul Gould Teknacron Circuits Ltd UK www.teknacron.com -----Original Message----- From: Francis Lai <[log in to unmask]> To: [log in to unmask] <[log in to unmask]> Date: 06 November 1998 22:45 Subject: [TN] Problem in Gold Plating >I work in gold plating. We are using electrolytic gold plating. > >It is pattern plating. However the gold leaks underneath the dry film. > >As a result the pattern is fatter after the dry film is removed. > >We develop the pattern dry film and thenn hardenn the dry film by > >exposing under UV light again. But still it leaks underneath the dry > >film. Could any one help ? > >WE also want to set up a pulse plating bath ourselves. Could any > >one give us some information onn how to start ? > >Thanks in advance!!!!!!!! > >my e-mail : [log in to unmask] ( Please do not send graphics, this > is text base) > >Thanks again > >Francis > ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################