We are evaluating heated, ultrasonic stencil cleaners and liquids. We are evaluating detergent based liquids, and heating them to 120 deg. F greatly enhances their cleaning capabilities. We are using no-clean solder paste, type mesh 3, at .020" pitch components. I am aware that you must stay below certain temperatures and times at temp to keep the epoxy from de-bonding from the stencil to the wire mesh, but, from articles I've read ("...recommend keeping liquid temps below 110 deg. F"), this seems somewhat ridiculous to me, so I want to ask: Is there a concern that temps could "expand/warp/change pitch/permanently deform" stainless steel (we use .006") in the fine-pitch or ultra-fine pitch areas? Any experience you "fine pitch swamis" have would be greatly appreciated! Thanx in advance! United Technology Electronic Controls Jeff L. Hempton, Sr. SMD Engineer E-mail: [log in to unmask] ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################