Could someone kindly settle a inner company dispute over what is
considered industry standard for solder coating (tin/lead).  IPC-6012
(Table3-2) specifies that "unfused tin/lead thickness for class 2 boards

is .0003" and further details that fused tin/lead solder coating
requires "coverage and solderable".  This is rather vague and leaves
alot of room for interpretation and hence where the argument begins.  In

our process, the initial coating of tin/lead is used as an etch resist
and is removed before S/M application (SMOBC).  After HAL, we have a
finished tin/lead thickness ranging between 165-323 microinches, which I

feel is insufficient.  I have read somewhere that "thick" solder coating

is between 300-500 u".  My questions is threefold:

a.  Is there a industry standard for "fused" solder (tin/lead) coating?
If so, what is it?
b.  Is 165-323 microinches considered a "thin" solder coating or the
norm?
c.  If our inhouse solder coating is insufficient on completed product,
is there a safe way to reHASL or add additional solder coating?

Any assistance offered would be greatly appreciated.

Regards

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