Hello, TechNet:

Reviewing an IC component specification here, we find the plated finish of
300-800 microinches 85/15 Sn-Pb. Many other spec sheets simply call for an
Sn-Pb finish. The part in question seems to wet poorly, forming very
shallow fillets.

Can anyone confirm the typical fusible tin-lead alloy for QFP leadframes is
more like eutectic composition?


thanks,



Jerry Cupples
Interphase Corporation
Dallas, TX USA
http://www.iphase.com

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