Hello, TechNet: Reviewing an IC component specification here, we find the plated finish of 300-800 microinches 85/15 Sn-Pb. Many other spec sheets simply call for an Sn-Pb finish. The part in question seems to wet poorly, forming very shallow fillets. Can anyone confirm the typical fusible tin-lead alloy for QFP leadframes is more like eutectic composition? thanks, Jerry Cupples Interphase Corporation Dallas, TX USA http://www.iphase.com ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################