Is it possible to monitor solder volume post-stenciling using transmissive X-ray equipment? Any feedback on potential vendors of such equipment? How is it achieved? Is it a grey scale density measurement? I know it is widely use for solder joint inspection after reflow, but apparently it is possible to measure volume right after the solder paste is stenciled onto the PWB.... thanks Marcelo Chan Lead Engineer - Advanced Manufacturing Technology Electronics Systems Sector, Harris Corp., FL ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################