Hi Mike, As far as I know, you have to do a zincate treatment to get a good adhesion between Al and Ni. This process is not yet really a standard process available on the market, but will be in the near future. My purpose is to have an an wetable surface for solder in the case of flip-chip. So try to contact Flip-Chip Technologies, IZM Berlin, Germany, IBM, Motorola, IC Interconnect, ... Hope this points you to the right direction. Regards Wolfgang Nuechter ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################