Return-Path: <[log in to unmask]> Received: from ipc.org ([209.42.29.30]) by email.aqs-inc.com (Netscape Messaging Server 3.01) with SMTP id 253 for <[log in to unmask]>; Tue, 10 Nov 1998 08:05:29 -0800 Received: from IPC#u#DOMAIN-Message_Server by ipc.org with Novell_GroupWise; Tue, 10 Nov 1998 10:13:46 -0600 Message-Id: <[log in to unmask]> X-Mailer: Novell GroupWise 4.1 Date: Tue, 10 Nov 1998 10:13:02 -0600 From: Hugo Scaramuzza <[log in to unmask]> To: [log in to unmask] Subject: Re: Solder-ball Mime-Version: 1.0 Content-Type: text/plain Content-Disposition: inline X-Mozilla-Status2: 00000000 Brian, I am not Technet. I am Hugo Scaramuzza, the Technet administrator. If you want to send this message to Technet, send it to Technet @ipc.org, not [log in to unmask] Hugo Scaramuzza Electronic Communications Administrator IPC 2215 Sanders Road Northbrook, IL 60062-6135 (847)509-9700 ext 5312 fax: (847)509-9798 [log in to unmask] >>> "Brian Koo" <[log in to unmask]> 11/10/98 10:09AM >>> Dear Technet users, I am experiencing some solder balls on some of PCBs' that we are assemblying now. We set the temperature according to recommended thermal profile based on Supermole which we are using to set first time processing board. Certain times, we do not see any solder balls for same PCB, but we are seeing solderballs that we ran last night. Mostly, balls are appear near capacitor location. We are contract manufacturer in San Jose. Please respond to my email. Thank you. Brian Koo