We have a product in which we have to place an optical sensor on a PWB very accurately wrt a set of
fixing holes for a lens.

We have been reasonably successful in the past using BGA packaged devices. However, for reasons that
are too boring to go into we have recently changed back to LCC packages. It seems that the position of
LCC packaged device wanders a lot more during reflow than the BGA. Does anyone have any suggestions
how the LCC can be fixed to the board during reflow to prevent it moving?



Eric Christison
Mechanical Engineer
VLSI Vision Ltd
Aviation House
31 Pinkhill
Edinburgh
EH12 7BF

Tel:    +44 (0) 131 539 8165
Fax:    +44 (0) 131 539 7141

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