We have a product in which we have to place an optical sensor on a PWB very accurately wrt a set of fixing holes for a lens. We have been reasonably successful in the past using BGA packaged devices. However, for reasons that are too boring to go into we have recently changed back to LCC packages. It seems that the position of LCC packaged device wanders a lot more during reflow than the BGA. Does anyone have any suggestions how the LCC can be fixed to the board during reflow to prevent it moving? Eric Christison Mechanical Engineer VLSI Vision Ltd Aviation House 31 Pinkhill Edinburgh EH12 7BF Tel: +44 (0) 131 539 8165 Fax: +44 (0) 131 539 7141 ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################