1/ In our copper bath, there are 3 anodes in the front side and 3 anodes on the back side with the panel immersing in copper sulphate agitating between the front and back anodes. Say, if I get X mil in an hour of copper plated. 2/ If for pattern plating, the front to be plated is only half of the area to be plated at the backside. If I used 2 anodes in the front and 4 annodes at the back, do I still get X mil of copper plated on both the front and back sides of the panel? 3/ What is the theory of the ratio of anodes to cathode in copper or tin lead plating? 4/ If the front and back side anodes are not equal, will this affect the shape of the plated trrough hole? Could somebody help me with this? I work in copper plating for 2 years but I do not know the theory behind it. I am just curious to know. Thanks in advance!!!!!! my e-mail: [log in to unmask] (this is text base pls do not send graphics) Thanks again Francis ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################