1/ In our copper bath, there are 3 anodes in the front side and 3 anodes

   on the back side with the panel immersing in copper sulphate agitating

   between the front and back anodes. Say, if I get X mil in an hour of

   copper plated.

2/ If for pattern plating, the front to be plated is only half of the area

   to be plated at the backside. If I used 2 anodes in the front and 4 annodes
   at the back, do I still get X mil of copper plated on both the front and

   back sides of the panel?

3/ What is the theory of the ratio of anodes to cathode in copper or tin

   lead plating?

4/ If the front and back side anodes are not equal, will this affect the

   shape of the plated trrough hole?

Could somebody help me with this? I work in copper plating for 2 years but

I do not know the theory behind it. I am just curious to know.

Thanks in advance!!!!!!

my e-mail: [log in to unmask] (this is text base pls do not send
                                      graphics)

Thanks again

Francis

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