To all technetters: Our design department is contemplating use of a CQ132 Ceramic Quad Flatpack. This is a 132 lead device with 25 mil pitch leads. The part will come supplied on a lead frame where we will program the part, then press the part out, screen print and place, and then reflow the part. A number of questions: 1) I have been dealing with Fancort Industries to design a die for stamping out the Gull wing form. Are there any other companies who specialize in forming equipment for this kind of part ? 2) Is there a correct pad geometry for this part ?? IPC spec ?? Reference ?? 3) Anybody out there familiar with the proecess that I've just described ? Hopefully theres someone out there in a "been there, done that" mode that can give me some pointers. 4) Among the users of CQ132 QFP's, have you used your parts in a military environment capable of meeting vibration and thermal requirements ?? 5) Anybody with forming equipment out there who can tell me how easy or difficult it was to generate a die design ?? Any advice ?? Thanks to any and all who respond. I am really up against the wall on this one. Bill Kasprzak Moog Inc. [log in to unmask] 716-652-2000 x2507 ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################