I am wondering if anyone has had any recent problems with LPI soldermask
adhesion over reflowed tin/lead. I realize that IPC-SM-840 says that there
are adhesion problems but still gives guidelines for adhesion for types T
and H that we are not adhering to (ie more that 10% of soldermask coming
off on tin/lead traces, after reflow). We are using Morton Epic 200. We
have studied our cleaning and surface prep as well as our curing
times/temps and we cannot seen to find anything that we are doing that is
different. Any info/comments would be appreciated.
Terrie Black
QA Mgr. CSI

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