I am wondering if anyone has had any recent problems with LPI soldermask adhesion over reflowed tin/lead. I realize that IPC-SM-840 says that there are adhesion problems but still gives guidelines for adhesion for types T and H that we are not adhering to (ie more that 10% of soldermask coming off on tin/lead traces, after reflow). We are using Morton Epic 200. We have studied our cleaning and surface prep as well as our curing times/temps and we cannot seen to find anything that we are doing that is different. Any info/comments would be appreciated. Terrie Black QA Mgr. CSI ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################