My copy of IPC-A-610-B does not address the issue of solder ball formation as a result of the SMT process. Has IPC taken a position on this matter or is there another publication that addresses this issue? Thanks, Jim Christenson Manager, Quality Assurance Cherokee International ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################