Any information out there regarding immersion gold over nickel on SMT printed wiring boards. This gives a very flat surface for fine pitch placement. When I read in J-STD-001B in para.5.4.1 Gold Removal, that "all" surfaces to be soldered must have the gold removed, I am assuming that means the gold pads also. Is this the intent? Does this preclude the use of immersion gold over nickel is out? Being a MIL house there is concern with gold embrittlement of the solder joints. Barrie Candeas GTE Taunton Ma. [log in to unmask] ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################