Tehcnetters,

     Could anyone advise the source of anything (solder resist,or other
     chemicals,etc.,) that can be printed in between closely located solder
     lands, such as those for SOIC or DIP packages, so that solder bridging
     between these lands during wavesoldering can be prevented or
     minimized?

     Thanks for your help in advance.

     Regards,
     KenF, Nov 2,98

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