Is there an IPC specification for vias being intentionally filled and
plugged with liquid soldermask material (not dry film) for SMT boards, such
as...
level/percent of fill requirements
percent allowed less than preferred fill level
minimum acceptable fill level
etc., etc.
Thanks,
Scott Lolmaugh
Honeywell IAC, Inc.
Surface Mount & Advanced Manufacturing Technology
Production Engineering
602/313-3551 (voice)
602/313-3402 (FAX - Please call before sending)

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