Is there an IPC specification for vias being intentionally filled and plugged with liquid soldermask material (not dry film) for SMT boards, such as... level/percent of fill requirements percent allowed less than preferred fill level minimum acceptable fill level etc., etc. Thanks, Scott Lolmaugh Honeywell IAC, Inc. Surface Mount & Advanced Manufacturing Technology Production Engineering 602/313-3551 (voice) 602/313-3402 (FAX - Please call before sending) ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################