Hello techNetters, I am looking for the ideal temperature profile for curing the LOCTITE CHIPKLEBER 360.( i.e., to glue and cure after placing the chip components on the bottom side of the Printed circuit board, before the board goes for wave soldering ) thanks in advance, amith ______________________________________________________ Get Your Private, Free Email at http://www.hotmail.com ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################