Earl; If you would be so kind to forward your paper to me regarding the study you did on HASL fluxes would be greatly appreciated. Fred Shubert -----Original Message----- From: [log in to unmask] <[log in to unmask]> To: [log in to unmask] <[log in to unmask]> Date: Friday, November 20, 1998 11:08 AM Subject: Re: [TN] Tin/Lead Solder Coating Minimum Thickness Requirements >Ah Eddie, > >Herein lies the rub. I have not reviewed current flux types used for HASL processing. In times >past, nearly all HASL fluxes were water soluble or RMA types (what else?). I can only suggest you >start with your current supplier and attempt determining their use, where they purchase, what are >the specs, and what else is available. Also, many "major," technically astute fabrication >capabilities know much more than the "average" job shop, and some can discuss the matter more >clearly than others. > >My apologies for not being more current, but I am somewhat anti-HASL (as you may have gathered). >Therefore, I have been constantly searcing for the "perfect" alternative. > >I can say that most board shops, in which I consult, no little of assembly processes - let alone >soldering principles. This ignorance increases (not being negative - just providing observations as >fab suppliers make boards - don't they?) concerning fluxes, flux composition and application >requirements, conveyor speeds, thermal deltas, solder temperatures and dwell times, etc. I've just >described major sub-processes in the wave solder process, haven't I? > >I certainly appreciate your concern and positive attitude concerning such a vital issue. Because of >this, I will begin again looking into the matter more. Also, I have an old article I published if >your are interested. It is a rather large Jpeg file and will take about 20 minutes to transfer. I >mention this because I do not wish to "clog" your computer plumbing. > >Enjoy, > >Earl Moon > >################################################################ >TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c >################################################################ >To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: >To subscribe: SUBSCRIBE TechNet <your full name> >To unsubscribe: SIGNOFF TechNet >################################################################ >Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. >For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 >################################################################ > > ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################