Michael, A colleague has given me a ref Developments in Paassive Thermal Management Systems for Electronics S. Hamilton Circuit World Vol 14 Number 1 In the UK, TECAN Components Ltd have lots of info http://www.tecan.co.uk Hope this helps. Barry Bates. > -----Original Message----- > From: Hiteshew, Michael [SMTP:[log in to unmask]] > Sent: 19 November 1998 21:40 > To: [log in to unmask] > Subject: [TN] Heat Sinks on PWBs > > *** WARNING *** > > This mail has originated outside your organization, > either from an external partner or the Global Internet. > Keep this in mind if you answer this message. > > > Hey Guys, > Can anyone direct to me to any technical papers (or > books) comparing > various methods of heat sinking PWBs. I'm looking for > information that > compares cost, thermal efficiency, mechanical strength, etc. > Even papers > that addressed only a single method (no comparison) would be of > value. > Specifically, the options we're considering are: > > A) Nickel plated copper laminated to the primary component > side. > > B) Aluminum plate bonded to the secondary side with thermally > conductive and > compliant glue. > > C) Copper-invar-copper core material. > > Thanks for your help. > > Michael Hiteshew > Lockheed Martin Launching Systems > [log in to unmask] > (410) 682-1259 > > ############################################################### > # > TechNet E-Mail Forum provided as a free service by IPC using > LISTSERV 1.8c > ############################################################### > # > To subscribe/unsubscribe, send a message to [log in to unmask] > with following text in the body: > To subscribe: SUBSCRIBE TechNet <your full name> > To unsubscribe: SIGNOFF TechNet > ############################################################### > # > Please visit IPC's web site (http://www.ipc.org) "On-Line > Services" section for additional information. > For technical support contact Hugo Scaramuzza at [log in to unmask] > or 847-509-9700 ext.312 > ############################################################### > # ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################