Hello folks, Happy election day to those in the States! We've had problems with rigid flex boards failing for separation between the innerlayer trace and the PTH barrel after assembly (they passed ET before assembly, but they have an open due to this defect after). To try and catch them before assembling them, our board supplier suggested a heated electrical test. We've done this once before, and we were able to catch some of the problems. I feel the need to do it again (same vendor, we need the boards) before running a batch, but now I'm starting to wonder if this test will have the potential to induce failures. Here are the parameters: 250 F 2 hours test hot The temperature is the same temp we use for pre-bake during assembly (to drive off moisture for delamination). Does this test have the potential to cause any additional problems? Anybody have any suggestions for how to check these boards before use? Thanks, Matt Matthew Sanders PWB Procurement Engineer, Trimble Navigation Limited [log in to unmask] Phone: (408) 481-7817 Fax: (408) 481-8590 ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################