There are a variety of peroxide/sulfuric acid-based materials on the market (Alpha, MacDermid, LaPorte/Electrochemicals, Shipley) that seem to be very well received in Europe. There is also a formic acid-based material from MEC that apparently is widely used in Japan. These microetches have additives which increase the surface topography and in some cases leave a lightly "oxidized" surface which can range from pinkish to brownish, based on the examples I have seen. We use some Durabond and some oxide in this facility; we will be installing afully-conveyorized oxide replacement process in the next 8 weeks, as neither of the existing processes will work with the type of parts that we are attempting to manufacture. FJ >>> J M <[log in to unmask]> 10/08/98 01:24pm >>> We are in the process of selecting a new line for prelamination, and we would like to know of other proven alternatives to Oxide/Durabond. We also would like to have a fully conveyorized system capable of linking to conveyorized AOI and to Lamination. Thank you for your help ______________________________________________________ Get Your Private, Free Email at http://www.hotmail.com ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################ ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################