H i Techneter : I have two questions. 1. Why the wire bonding process which needs gold deposit on the substrate ? 2. Why the gold wire bonding which needs thicker gold deposit than alumium wire bonding ? Please advise me. Thanks for your help Alex Liao ccfswr , 10/14/1998 PM 4:34 _____________________________________________________________________ Sent by Hello. Get your free e-mail at http://www.hello.com.tw ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################