Tom,
I'd be worried about standoff height and joint shape with the wave approach.
Someone suggested spacers which would help with the standoff, but you might get
a nasty joint shape that will cause reliability problems.  I'd definitely try
it if you're backed into a corner, but plan on some sectioning to make sure
it's reliable.
Rod Martens.




Hi everyone,

        I just thought of something else that might work.

        Since the pads are thru-hole, can I just place the component on top and
        run it through wave?  Since the pads are plated thru-hole, solder will
        come up and create a joint with BGA balls.

        Any input would be greatly appreciated.

        Tom Han
        Ardent Systems

__________________________________________________
Rod Martens
Process Technology Engineer
Hewlett-Packard Company
3400 E. Harmony Rd. MSA5-6L
Fort Collins, CO 80528-9599
(970)898-7709
<a href="/scripts/wa.exe?LOGON=A3%3Dind9810%26L%3DTECHNET%26E%3D7bit%26P%3D821921%26B%3D--openmail-part-10f560ef-00000001%26T%3Dtext%252Fplain%3B%2520charset%3DUS-ASCII%3B%2520name%3D%2522BDY.TXT%2522%26N%3DBDY.TXT" target="_parent" >[log in to unmask]</a>