I am having difficulty in believing something a packaging engineer is telling me. We have a design of sensor which is now BGA packaged. The balls are 0.030" diameter and 0.023" high. After reflow I am assured that the collapsed height will be 0.019" +/-0.001"(given a correctly dimensioned footprint) . I have no problem with the 0.019", it's the +/-0.001" that stretches my credibility threshold. Is there anyone out there that can confirm or deny this tolerance? Regards, Eric Christison ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################