I am having difficulty in believing something a packaging engineer is telling me.

We have a design of sensor which is now BGA packaged. The balls are 0.030" diameter and 0.023" high.
After reflow I am assured that the collapsed height will be 0.019" +/-0.001"(given a correctly
dimensioned footprint) . I have no problem with the 0.019", it's the +/-0.001" that stretches my
credibility threshold.

Is there anyone out there that can confirm or deny this tolerance?

Regards,




Eric Christison

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