I have also seen that problem, especially on epoxy encapsulated magnetics. I suspected it was a mold release material but never investigated. The question is, if it is an insulating material, why coat it? >-----Original Message----- >From: Bridget Piper [SMTP:[log in to unmask]] >Sent: Monday, October 12, 1998 8:31 AM >To: [log in to unmask] >Subject: Re: [TN] Confomal coating adhesion > >I have been informed that several fine coats rather than one >thicker coat improves adhesion, however, I have no practical >experience of it to back this up. Might be worth a try, but it >will increase your process time. And yes, cleanliness is an >issue. i suggest you approach your supplier.........Bridget > > >> -----Original Message----- >> From: Paul Stolar [SMTP:[log in to unmask]] >> Sent: 12 October 1998 15:09 >> To: [log in to unmask] >> Subject: [TN] Confomal coating adhesion >> >> *** WARNING *** >> >> This mail has originated outside your organization, >> either from an external partner or the Global Internet. >> Keep this in mind if you answer this message. >> >> >> Does anyone have any good experience at improving >> conformal coating >> adhesion to plastic packaging? >> >> Is it a cleanliness issue, or is it inherent in materials? >> >> ############################################################### >> # >> TechNet E-Mail Forum provided as a free service by IPC using >> LISTSERV 1.8c >> ############################################################### >> # >> To subscribe/unsubscribe, send a message to [log in to unmask] >> with following text in the body: >> To subscribe: SUBSCRIBE TechNet <your full name> >> To unsubscribe: SIGNOFF TechNet >> ############################################################### >> # >> Please visit IPC's web site (http://www.ipc.org) "On-Line >> Services" section for additional information. >> For technical support contact Hugo Scaramuzza at [log in to unmask] >> or 847-509-9700 ext.312 >> ############################################################### >> # > >################################################################ >TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c >################################################################ >To subscribe/unsubscribe, send a message to [log in to unmask] with following >text in the body: >To subscribe: SUBSCRIBE TechNet <your full name> >To unsubscribe: SIGNOFF TechNet >################################################################ >Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section >for additional information. >For technical support contact Hugo Scaramuzza at [log in to unmask] or >847-509-9700 ext.312 >################################################################ > ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################