Jacob - The term throwing power is often misused. It refers to the uniformity of a deposit thickness over a varying current density range. It's often confused with the cosmetic uniformity achieved when the deposit "looks" the same in the high and low current density areas of a cathode. Good throwing power would thus be achieved when the deposit on a circuit board is 1 mil in the hole and 1 mil on the surface.....everywhere on the board. Or, 1 mil on the surface and 1 mil in the bottom of a blind via hole, especially a deep one. That's good throwing power. Thought of another way: uniform plating thickness distribution in any cavity or blind area where there is a disparity of current distribution from high to low current density areas. Stay put and see what else shows up on this question. It can elicit a multitude of responses. Roger Mouton ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################