Jacob -

The term throwing power is often misused.  It refers to the uniformity of a
deposit thickness over a varying current density range.  It's often confused
with the cosmetic uniformity achieved when the deposit "looks" the same in the
high and low current density areas of a cathode.

Good throwing power would thus be achieved when the deposit on a circuit board
is 1 mil in the hole and 1 mil on the surface.....everywhere on the board.
Or, 1 mil on the surface and 1 mil in the bottom of a blind via hole,
especially a deep one.  That's good throwing power.  Thought of another way:
uniform plating thickness distribution in any cavity or blind area where there
is a disparity of current distribution from high to low current density areas.
Stay put and see what else shows up on this question.  It can elicit a
multitude of responses.

Roger Mouton

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