Hi, all: I got a request to have Au plating on both side of the board with different thickness ( one side 75 m-in and the other side 15 m-in). Try to think the way doing that and like to ask your input. One way is to plate Cu pattern and Au for 15 m- in both side and then mask one side with peelable SM something, for example, to continue Au plate the other side; Question is whether dry film on the other side be able to survive a couple of wet-dry cycle? The other way is to play with plating and shield one side more. Wondering how reliable it can be? Third way is to coat dry film one side after Cu pattern plating without image nothing to do Au plating, then develop 2nd coat and repeat for the other side. But it only can be done under yellow light. The last option to put something which easy to apply on and get off and able to resist gold plating. Don't know what it is? Do you have any other idea ? Like to hear your thoughts and experience. ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################