Hi, With all the current discussion of solderability issues, I'm hoping some of you may be able to apply your expertise and give me some insight into a problem we seem to consistently have. When soldering components with palladium plated leads, we do not seem to get any wetting on the leads. It kind of looks like the 'footprint in mud' affect. On pcb's where we have this condition, all other components have soldered fine with good fillets and wetting. Checks of the oven profile indicate a good profile for the paste we're using (Kester R598, water soluble). Currently we've only found this on components from TI, so I don't know if it's only their components or the plating in general. Question: Are there any recommendations for profile, paste, process, etc. that differ from 'standards' when working with these types of components? Thanks. Rick Thompson Ventura Electronics Assembly 2665A Park Center Dr. Simi Valley, CA 93065 [log in to unmask] (805) 584-9858 voice (805) 584-1529 fax ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################