Jeremy Drake wrote: > > hard plastic, or metal, or a soft rubber. The soft rubber is more prone to > picking up debris that can be pressed into each die surface, damaging each > device. Hard plastic, or metal can work well if the push up of the die from > the tape and the contact with the tip is well controlled and gentle. Edge > contact by grippers is probably the ideal, but is mechanically more > complicated. This is a good method for things like area array flip chips. > Also depends on your die design. If you're using air bridges in your die you're at a HUGE risk of damage and edge pick up using a collet is the way to go. > 3, Top side damage is the obvious risk, see above, but back side, edge > and corner damage is also possible. The needles can put microcracks in the > die that can grow under stress. This is one reason for using rounded > needles to push up the die that don't pierce the tape. Damage to the edges > and corners of die by the sawing operation, flexing of the sawn wafer on > tape, or impact damage with the edges of waffle packs can also give chip > outs and microcracks that can grow under stress. This is particularly a > concern with flip chip devices, where the silicon can be under high stress. > > 4, When I was involved in this work over three years ago control was by > periodic inspection. The risk was low, but if problems occured it could > destroy large numbers of parts. I don't know if anyone has come up with a > better method since. > > regards, Jeremy Drake > Celestica Ltd. > Stoke on Trent > England > ---------------------- Forwarded by Jeremy J Drake/HQ/CUK/Celestica on > 20/10/98 08:13 --------------------------- > > Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please respond > to Manish <[log in to unmask]> > > To: [log in to unmask] > > cc: (bcc: Jeremy J Drake/HQ/CUK/Celestica) > > Subject: [TN] Reg: Dicing operations > > Hello everybody > > I would appreciate if somebody could please help me with the following: > > 1.0 where could i find information about the wafre dicing practices used > in the industry. > > 2.0 After the dicing opration is completed, the dice are placed in the > waffle packs. What kind of pick up tips are used to transfer the dice > from the wafer to the waffle packs. > > 3.0 Would the transferring of the dice from the wafer to the waffle pack > introduce damage to the top side or the back side of the dice. > > 4.0 What are the current practices used in the industry in order to check > those damages. In other words hw does one assure a defect free prodcut to > the customer. > > Knowing the above is kind of urgent for me. Therefore, > Any help in this regard would be greatly appreciated. > > Regards > Manish > > --------------------------------------------------------------------------- > - > > Those who do not remember the past regret it, Those who misremember > the past repeat it as a proof. > --------------------------------------------------------------------------- > - > > ################################################################ > TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c > ################################################################ > To subscribe/unsubscribe, send a message to [log in to unmask] with following > text in the body: > To subscribe: SUBSCRIBE TechNet <your full name> > To unsubscribe: SIGNOFF TechNet > ################################################################ > Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section > for additional information. > For technical support contact Hugo Scaramuzza at [log in to unmask] or > 847-509-9700 ext.312 > ################################################################ > > ################################################################ > TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c > ################################################################ > To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: > To subscribe: SUBSCRIBE TechNet <your full name> > To unsubscribe: SIGNOFF TechNet > ################################################################ > Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. > For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 > ################################################################ ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################