Date sent:              Tue, 6 Oct 1998 01:31:44 +0100
From:                   Jacob Ransborg <[log in to unmask]>
Subject:                Throwing Power

> Hi Tech Netters
>
> I have seen different ways to define the throwing power in a Cu-plating
> process.
> Can anyone show/tell me the exact definition and explane what throwing
> power means.
>
> Regards
> Jacob Ransborg
>

Simply, it is the ability of a bath to produce a level (uniform) surface.  There is
both macro and micro throwing power.  Micro is defined as regarding depth
features under 1 cm.  Poor throwing power gives an uneven plating thickness.
In circuit board mfg, throwing power usually is defined as the variation between
the plated pad thickness and the hole wall plated thickness.  Sometimes it is
used to described the dogbone effect in the hole, front to back.

Get a copy of Lowenheim, Modern Electroplating, pp 30-32 and it's all there.
Your library should be able to get it for you.  I've got the '74 edition, there may
be a newer one.

Best Regards,

Bob Mesick
Remco Engineering
Water and Wastewater Treatment Systems
http://www.remco.com
[log in to unmask]

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