Date sent: Tue, 6 Oct 1998 01:31:44 +0100 From: Jacob Ransborg <[log in to unmask]> Subject: Throwing Power > Hi Tech Netters > > I have seen different ways to define the throwing power in a Cu-plating > process. > Can anyone show/tell me the exact definition and explane what throwing > power means. > > Regards > Jacob Ransborg > Simply, it is the ability of a bath to produce a level (uniform) surface. There is both macro and micro throwing power. Micro is defined as regarding depth features under 1 cm. Poor throwing power gives an uneven plating thickness. In circuit board mfg, throwing power usually is defined as the variation between the plated pad thickness and the hole wall plated thickness. Sometimes it is used to described the dogbone effect in the hole, front to back. Get a copy of Lowenheim, Modern Electroplating, pp 30-32 and it's all there. Your library should be able to get it for you. I've got the '74 edition, there may be a newer one. Best Regards, Bob Mesick Remco Engineering Water and Wastewater Treatment Systems http://www.remco.com [log in to unmask] ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################